Sesame Summit 2026 – application open
SEMRON develops AI chips with the highest intelligence density to bring server-class models to edge devices.
SEMRON develops a 3D scaled AI inference chip, incorporating GPT-3.5-like models on a square cm silicon with minimal power consumption. This revolutionary CMOS-compatible semiconductor technology enables running generative AI at the edge, making it possible for wearable tech, smartphones, and beyond. With a trend towards large foundation models, SEMRON can serve multiple markets with minimal adjustments and simplify the software stack.
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