Sesame Summit 2026 – application open
SEMRON develops AI chips with the highest intelligence density to bring server-class models to edge devices.
SEMRON develops a 3D scaled AI inference chip, incorporating GPT-3.5-like models on a square cm silicon with minimal power consumption. This revolutionary CMOS-compatible semiconductor technology enables running generative AI at the edge, making it possible for wearable tech, smartphones, and beyond. With a trend towards large foundation models, SEMRON can serve multiple markets with minimal adjustments and simplify the software stack.
Stay at the forefront with our curated guide to the best upcoming Tech events.